Today's post is for February's CAS Mix Up Challenge, Hideko is Hostess and wants us to use Dimensional Die-cuts + Stamping + Your Choice. I sponged Distress Ink on my card, splattered the sponging with Water and when it was dry I Taped the back of my card where I was going to die cut the background. I die cut the pattern and then put foam on the small diamond die cut pieces to give them dimension. I then cut the Daisy flowers with the Succulent Framelit Dies, cut them in half layed them on top of each other. The centre is the little cherry from the Build a Cupcake Punch, which I sponged with Crushed Curry Ink after cutting the stem off. I then arranged the flowers and stems on the background and finished off with the Sentiment.
CAS Mix Up: Dimensional Die Cuts, Sponging, Water Droplets, Punch, Stamping
Supplies:
Stamps: S/U's Happiest Birthday WishesCard: Thick and Thin Whisper White
Ink: Tim Holtz Peeled Paint Distress Ink, S/U's Crushed Curry
Cool Tools: Big Shot, Sizzix Succulent Framelit Dies, Sizzix Eclectic Layers Thinlit Dies, Sizzix Stylish Stems Framelit Dies, Sponges, Cherry from Build A Cupcake Punch, Dble Sided Tape, 1" Dble Sided Tape, Foam Tape, 2 Way Glue Pen, Tombow Multi Purpose Glue
Also added to the Crafters Magazine Take It Makit It Challenge.
Thanks for dropping in today, great to see you here.
Hugs,
